This specially blended non-woven structure wipes are soft and tough and will not scratch surfaces when used wet or dry.Įffective in cleaning undersides of stencil between prints to prevent smearing of solder paste, solder balling and other problems associated with printing operation. ![]() This wipe is effective in cleaning understencils between prints because of its super absorbency extremely low shredding and particle generation, purity and resistance to tearing. ![]() ![]() CleanRoll wipes have been developed to support the high standards necessary in the electronics industry.
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